Discretionary fly wire chip interconnection

Details Discretionary fly wire chip interconnection Discretionary fly wire chip interconnection

1979-05-07

1981-03-03

Kucia, Richard R.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361403, 361409, 174 685, H05K 118

Patent

active

042544459

ABSTRACT:
A module for LSI chips includes an orthogonal array of sets of pads and fan-out metallization for a large number of chips. Running parallel to the sides of the chips and the fan-out area are several parallel prefabricated, thin film engineering change interconnection lines terminating in pads adjacent to the fan-out. The pads are arranged to permit discretionary connections of the fan-out pads to the engineering change pads with minimal crossovers by means of short fly wires. A staggered pad arrangement minimizes potential crossovers and maximizes the number of interconnection lines that can be fabricated.

REFERENCES:
patent: 3072734 (1963-01-01), Fox
patent: 3474297 (1969-10-01), Bylander
patent: 3478425 (1969-11-01), Cooke
patent: 3496419 (1970-02-01), Sakellakis
patent: 3562592 (1971-02-01), Cooke
patent: 3717800 (1973-03-01), Thillays
patent: 3777221 (1973-12-01), Tatsuko
patent: 3795974 (1974-03-01), Calhoun
patent: 3803483 (1974-04-01), McMahon
patent: 3895181 (1975-07-01), LaGrange
patent: 3917984 (1975-11-01), Kong
Ho et al., Planar Wiring Repair Technique for the Thin-Film Metal Package via Solder Evaporation, IBM Tech. Bull., V. 20, #9, 02/78.

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