Discrete wafer assembled cookie and method of making same

Details Discrete wafer assembled cookie and method of making same Discrete wafer assembled cookie and method of making same

1996-02-20

1998-03-24

Fortuna, Ana

Food or edible material: processes, compositions, and products

Imitated, simulated, ornamental, three-dimensional product...

426 94, 426112, 426119, 426120, A23G 100

Patent

active

057310203

ABSTRACT:
A food product comprising a plurality of preformed discrete wafers being selectively assembled by the consumer into a multi-layer cookie or snack having desired layers of edible food product such as a potato chip or corn chip, etc. with one or more selectable intermediate layer(s) or filler substances such as chocolate, peanut butter spread, etc. disposed between the outer cookie/chip layers. The preformed and packaged layers enable the snack food item to be selectively assembled and arranged by the consumers to suit his/her individual taste and to enable the consumers to experiment with multiple sandwich/cookie constituent ingredient combinations/arrangements.

REFERENCES:
patent: 2007261 (1935-07-01), Stover
patent: 4194300 (1980-03-01), Swanson et al.
patent: 4560562 (1985-12-01), Schroeder
patent: 4733863 (1988-03-01), Novotny
patent: 4943063 (1990-07-01), Moreau
patent: 4948602 (1990-08-01), Boehm
patent: 5017394 (1991-05-01), MacPherson et al.
patent: 5500234 (1996-03-01), Russo

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