Discrete electronic component arrangement including...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics

Reexamination Certificate

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C257SE51003, C257SE27009, C257SE27033, C257S774000, C257S728000, C257S773000, C257SE27016, C257S528000, C257S712000, C257S713000, C257S698000, C257S691000, C257S700000, C257S701000, C257S703000, C257S796000, C257S784000, C257S786000, C257S676000, C257S724000, C361S760000, C361S763000, C361S734000, C361S766000

Reexamination Certificate

active

07148554

ABSTRACT:
An electronic component arrangement includes a discrete electronic component having first and second terminals and a centre-exposed pad. A substrate has a first electrical conductor electrically connected to the first terminal, a second electrical conductor electrically connected to the second terminal, and a third electrical conductor. A thermally conductive element is in direct thermal communication with both the centre-exposed pad of the electronic component and the third electrical conductor of the substrate.

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European Search Report dated Mar. 20, 2006.

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