Discrete component pad array carrier

Details Discrete component pad array carrier Discrete component pad array carrier

1996-06-07

1998-03-17

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361762, 361763, 361765, 361766, 361767, 174 51, 174 521, 439 65, 439 761, 439591, H05K 116

Patent

active

057294380

ABSTRACT:
A pad array carrier module for packaging discrete electronic components is provided. A circuit substrate (8) contains component mounting pad pairs (20), each consisting of a power pad (22) and a ground pad (21), on a first side (10). Component mounting pads are electrically connected by circuit traces (23), through conductive vias (14), to terminal solder pads (16) on the second side (12) of the circuit substrate. Some of the ground pads are connected to a common ground solder pad (17). Likewise, some of the power pads are connected to a common supply voltage solder pad (19). Solder spheres (18) are attached to the solder pads. Discrete electronic components (24) are conductively coupled (26) to the component-mounting pad pairs.

REFERENCES:
patent: 5241133 (1993-08-01), Mullen, III et al.
patent: 5504277 (1996-04-01), Danner
patent: 5519580 (1996-05-01), Natarajan et al.
patent: 5591941 (1997-01-01), Acocella et al.
patent: 5642265 (1997-06-01), Bond et al.

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