Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
1999-02-10
2001-04-10
Gaffin, Jeffrey (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S807000, C439S500000, C174S050510, C174S260000, C206S724000
Reexamination Certificate
active
06215669
ABSTRACT:
TECHNICAL FIELD
The present invention relates to a holder for leadless circuit elements.
BACKGROUND
Electronic devices have an ever increasing need for compact assembly of discrete components. Some discrete components are mounted by means of leads soldered to a circuit pattern on a circuit board. Others are surface mounted directly onto the circuit pattern. There is a limitation on the density of surface mounted components because space must be left around the component for a gripping head which positions the components on the circuit pattern. “Leadless Electronic Component Carrier” at U.S. Pat. No. 4,727,456, by Mehta describes a means for increasing the density of electronic components. It shows a trough having multiple vertical recesses into each of which a component is dropped. The trough has vertically oriented conductive paths corresponding to each component in each recess of the trough. These conductive paths extend down to feet of the trough which are soldered to a circuit board.
The Mehta solution invites oxidation of the conductive paths between the time at which the conductor, typically metal, is placed on the recess and the time at which the leadless component is dropped into the recess. Moreover, the Mehta solution does not prevent oxidation of the conductive paths as they press against metal contacts on the ends of the leadless component. The result is an electrical contact which is altered with time and progressively poorer as time progresses and oxidation increases. For solving the problem of mounting components, there is desired a solution that provides for mounting of leadless components without oxidation in a quick and inexpensive manner.
SUMMARY OF THE INVENTION
It is an object of the present invention to mount a leadless component in plastic molding.
It is an object of the present invention to provide circuit element inserts which are reduced in volume because of the use of a circuit component without leads.
It is an object of the present invention to provide a circuit element which when inserted into a circuit is easily retained because it is insert molded.
It is an object of the present invention to provide a circuit element which once inserted into a circuit element is not removed by vibrations experienced in product testing or actual use because the circuit element is insert molded.
It is an object of the present invention to provide cheaper assembly of electronic products because product assembly does not include means to hold the leads of a circuit element.
It is an object of the present invention to provide improved electrical connection between a circuit element and its interfacing circuit elements by insert molding of circuit elements after it has been inserted into a circuit such that the connection is not continually exposed to chemicals which would oxidize conductive materials making the connection.
According to the present invention, a planar conductive frame, for insertion into a mold, includes opposing flanges which can be bent downwardly for bending the flanges into hands and fingers for holding a leadless circuit element within a plastic mold. The present invention further includes an insert displacement connection integral to said frame and disposed to one side of said arms and hands for allowing the leadless circuit element to be included in a circuit. In further accord with the present invention, the assembly is molded in plastic. The hands and fingers integral to the flange keep a leadless component stable as plastic is injected into the mold so that the component doesn't float away and out of position.
One advantage of the present invention over the prior art is that it reduces the opportunity for oxidation of metallic contacts holding a circuit element or the contacts on the ends of that element because the present invention includes plastic molded in around the circuit element.
A second advantage is that the present invention includes less metal than the prior art because only as much metal is included as is needed to accomplish the goal—mounting a circuit element.
A third advantage is that the invention uses a single structure in that the hands and fingers formed of the flange perform both the mechanical function of holding the leadless circuit element while providing a conductive path through the circuit element.
These and other objects, features and advantages will become more apparent in light of the following text and drawings.
REFERENCES:
patent: 4881639 (1989-11-01), Matsuoka et al.
patent: 5007859 (1991-04-01), Sangregory et al.
patent: 5038253 (1991-08-01), Repplinger et al.
patent: 5111362 (1992-05-01), Flamm et al.
patent: 5211579 (1993-05-01), Seong et al
patent: 5225970 (1993-07-01), Palumbo
patent: 5369802 (1994-11-01), Murray
patent: 5567177 (1996-10-01), Foerstel et al.
patent: 5727688 (1998-03-01), Ishii et al.
patent: 5922489 (1999-07-01), Adachi
Foster David
Gaffin Jeffrey
Kovach Karl D.
Methode Electronics Inc.
Newman David L.
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