Disc package for semiconductor wafers

Details Disc package for semiconductor wafers Disc package for semiconductor wafers

1992-02-03

1994-03-08

Ansher, Bernard

Packages and containers for goods

Box or packaging container

Molded or stamped type, i.e., cast, vacuum formed, etc.

206334, 206508

Patent

active

D03448916

REFERENCES:
patent: D260237 (1981-08-01), Fuzere
patent: 4588086 (1986-05-01), Coe
patent: 4793488 (1988-12-01), Mortensen
patent: 4966284 (1990-10-01), Gregerson et al.

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