Directly sealed multi-chip module

Details Directly sealed multi-chip module Directly sealed multi-chip module

1982-07-23

1985-02-19

Tolin, G. P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361395, H05K 720

Patent

active

045009457

ABSTRACT:
A hermetic compression sealing system with a semi-conductor, multi-chip thermal conduction module, involving a ceramic substance which includes interconnected semi-conductor chips containing integrated circuits defining the module; an arrangement is provided for directly sealing the module involving a compression seal which is in direct bearing contact with the substrate, a cover in direct bearing contact with the compression seal, and a clamping plate for holding the cover, compression seal and ceramic substrate in sealing arrangement, thereby forming a sealed chamber surrounding the module; a gas charge, such as of helium or the like, within the chamber enables conducting heat from the semi-conductor chips of the ambient.

REFERENCES:
patent: 4381032 (1983-04-01), Cutchaw
"Thermally Enhanced-Structure", Coughlin, IBM Tech. Discl. Bull., vol. 21, No. 1, Jun. 1978, p. 185.
"Thermal Conduction Module", Blodgett, IBM Tech. Discl. Bull., vol. 26, No. 1, Jan. 1982, pp. 30-36.
"High Capacity Power-Package", Doo, IBM Tech. Discl. Bull., vol. 21, No. 5, Oct. 1978, pp. 1898, 1899.
"Integrated Module Heat Exchanger", Antonetti, IBM Tech. Discl. Bull., vol. 20, No. 11A, Apr. 1978, p. 4498.
"Device Cooling", Johnson, IBM Tech. Discl. Bull., vol. 20, No. 10, Mar. 1978, p. 3919.
"Silicon Heat Sink-Temperatures", Ahearn, IBM Tech. Discl. Bull., vol 21, No. 8, Jan. 1979, pp. 3378-3380.

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