Directly injected forced convention cooling for electronics

Details Directly injected forced convention cooling for electronics Directly injected forced convention cooling for electronics

2008-09-24

2011-12-13

Datskovskiy, Michail V (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S679460, C361S679530, C361S698000, C361S699000, C165S080400, C257S714000

Reexamination Certificate

active

08077464

ABSTRACT:
Electronic circuitry comprises a circuit board (34) and at least one component (30,32) mounted on the circuit board (34), wherein the at least one component (30,32) generates heat in use, the circuit board (34) includes at least one aperture (48, 50) aligned with the component (30,32) or a respective one of the components, and the electronic circuitry is configured to provide, in use, a path for coolant fluid to flow through the or each aperture (48, 50) and past the at least one component (30,32).

REFERENCES:
patent: 4839774 (1989-06-01), Hamburgen
patent: 5067047 (1991-11-01), Azar
patent: 5453911 (1995-09-01), Wolgemuth et al.
patent: 5901037 (1999-05-01), Hamilton et al.
patent: 6840794 (2005-01-01), Chiu
patent: 6977346 (2005-12-01), Jairazbhoy et al.
patent: 7215547 (2007-05-01), Chang et al.
patent: 7294926 (2007-11-01), Schubert et al.
patent: 7372148 (2008-05-01), Im et al.
patent: 7567090 (2009-07-01), Cote et al.

Affiliated with

Also associated with

Rating

Directly injected forced convention cooling for electronics does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Directly injected forced convention cooling for electronics, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Directly injected forced convention cooling for electronics will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4296083