Directly cooled circuit board for an electronic power circuit

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Patent

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Details

16510433, 257714, 361736, H05K 720

Patent

active

052629210

DESCRIPTION:

BRIEF SUMMARY
BACKGROUND OF THE INVENTION

The invention relates to a one sided circuit board for an electronic power circuit in SMD (surface mounted device) configuration.
Prior art circuit boards for electronic power circuits of this type are configured so that, in order to dissipate the resulting heat, either the entire circuit board or all circuit components involved in the development of excessive heat are mounted on cooling bodies. If power consumption is high, for example 250 W and more, such circuit boards and/or the cooling bodies must additionally be cooled by means of a fan. As a whole, this undesirably increases the structural volume required for such electronic power circuits.


SUMMARY OF THE INVENTION

It is therefore the object of the invention to provide a circuit board for an electronic power circuit in SMD configuration which, while avoiding the above-mentioned drawbacks, ensures sufficient good cooling in spite of its small structural configuration even with high power consumption.
The above object generally is accomplished according to the invention by a novel arrangement of a one-sided circuit board for an electronic power circuit in SMD configuration. More particularly, the above object is achieved according to the present invention by an arrangement which comprises a circuit board having first and second opposed surfaces formed of one of a steel substrate and a ceramic material substrate, an electronic power circuit in a surface mounted device configuration disposed on only the first surface of the circuit board, and a housing through which a liquid coolant flows which is and which is provided with inlet and outlet pipe connections for a liquid coolant, with the second surface of the circuit board forming at least a portion of an interior surface of a wall of the housing.
The integration, according to the invention, of the circuit board itself in a housing through which flows a liquid coolant brings about the great advantage of permitting simple and possibly even pressure-free liquid cooling of the circuit board. In particular, if the circuit board according to the invention is employed in machines which are equipped with a liquid circulating system, for example washing machines (water supply), ultrasonic washers and automobiles (radiator circulation), the circuit board according to the invention can be very easily integrated in the path of the circulating liquid as the cover of an already existing housing. In such cases, the additional space requirement, if any, for the circuit board according to the invention is very little, particularly when compared to the cooling bodies and/or fans required in the past.
As an advantageous feature of the invention, it is further provided that the circuit board according to the invention is configured in the form of a known hybrid board so that a very high mechanical strength can be realized for the circuit board and it can be adapted in this way, as part of a housing through which a coolant flows, to the mechanical strengths applicable for the housing.
Such a circuit board according to the invention in hybrid configuration can be manufactured in almost all conceivable shapes by means of known manufacturing processes and can be employed in the form of a cover or in a similar way on almost any housing shape, for example on rectangular, box-shaped, tubular or triangular housings or on shapes derived therefrom.
As a particular feature of the invention it is further provided that a further circuit for monitoring and determining its temperature and for controlling and regulating the coolant stream is provided on the circuit board according to the invention in addition to the electronic power circuit. In this way, it is possible in a simple manner to regulate and adapt the flow of coolant, as a function of the power consumption and the heat inevitably developed thereby, to the amount of heat necessary to be removed.
Further advantageous features of the invention are defined in the dependent claims.


BRIEF DESCRIPTION OF THE DRAWINGS

The invention will be described

REFERENCES:
patent: 3956673 (1976-05-01), Seid
patent: 4053942 (1977-10-01), Dougherty, Jr. et al.
patent: 4547834 (1985-10-01), Dumont
patent: 4706164 (1987-11-01), L'Henaff et al.
patent: 4739443 (1988-04-01), Singhdeo
patent: 4893590 (1990-01-01), Kashimura
IBM Tech Discl Bull vol. 27 No. 9 Feb. 1985, p. 5286 "Block Cooling--Dissipation", Gruber et al.

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