Directly bonded simm module

Details Directly bonded simm module Directly bonded simm module

1989-02-15

1991-02-12

Mintel, William

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 75, 357 80, 357 45, 361400, 361412, 361421, H01L 2328, H01L 2316, H01L 3902, H01L 2710

Patent

active

049928503

ABSTRACT:
A leadframe interconnect package is tape automated bond (TAB) bonded to circuitry on the chip and which provides a circuit connection for subsequent connection to a printed circuit board. The encapsulated chips will replace both the leadframe and printed circuit board (electrical only) as we now know it in the conventional SIMM module.

REFERENCES:
patent: 4656605 (1987-04-01), Clayton
patent: 4903113 (1990-02-01), Frankeny et al.

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