Directly bonded board multiple integrated circuit module

Details Directly bonded board multiple integrated circuit module Directly bonded board multiple integrated circuit module

1989-02-15

1991-02-12

Mintel, William

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 75, 357 80, 357 45, 361400, 361412, 361421, H01L 2328, H01L 2316, H01L 3902, H01L 2710

Patent

active

049928490

ABSTRACT:
A leadframe interconnect package is tape automated bond (TAB) bonded to circuitry on the chip and which provides a circuit connection for subsequent connection to a printed circuit board.
The configuration of integrated circuit chips mounted onto TAB circuitry and then encapsulated permits a variety of cooperative functions to be performed by a single lead attached chip assembly, even though multiple chips are used in the circuit.

REFERENCES:
patent: 4656605 (1987-04-01), Clayton
patent: 4903113 (1990-02-01), Frankeny et al.

Affiliated with

Also associated with

Rating

Directly bonded board multiple integrated circuit module does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Directly bonded board multiple integrated circuit module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Directly bonded board multiple integrated circuit module will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-24265