Directional spray pad scrubber

Abrading – Abrading process – With tool treating or forming

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Details

451285, 451287, 451444, 15 881, 134153, 134199, 134143, B24B 5300

Patent

active

057795223

ABSTRACT:
The present invention is a pad scrubber that cleans the planarizing surface of a polishing pad used in CMP processing of semiconductor wafers. The pad scrubber has a fluid manifold, a first nozzle attached to one side of the manifold, and a second nozzle attached to another side of the manifold. The first nozzle directs a first fluid stream generally outwardly toward a peripheral edge of the pad, and the second nozzle directs a second fluid stream generally outwardly to the peripheral edge of the pad and also toward the first fluid stream. The first and second fluid streams converge on the planarizing surface of the pad to separate accumulated waste matter from the polishing pad and to create a contained stream of separated particles that flows across the planarizing surface to the peripheral edge of the pad.

REFERENCES:
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patent: 4326553 (1982-04-01), Hall
patent: 4519846 (1985-05-01), Aigo
patent: 5154021 (1992-10-01), Bombardier et al.
patent: 5216843 (1993-06-01), Breivogel et al.
patent: 5348033 (1994-09-01), Levit
patent: 5349978 (1994-09-01), Sago et al.
patent: 5384986 (1995-01-01), Hirose et al.
patent: 5531635 (1996-07-01), Mogi et al.

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