Metal fusion bonding – Including means to apply flux or filler to work or applicator – By partial or total immersion of work or applicator into liquid
Patent
1996-11-25
1998-08-18
Heinrich, Samuel M.
Metal fusion bonding
Including means to apply flux or filler to work or applicator
By partial or total immersion of work or applicator into liquid
118410, 222606, B23K 306
Patent
active
057948372
ABSTRACT:
A flow control device for a solder wave apparatus that includes an outlet or nozzle from which molten solder flows in an upward direction to contact the lower surface of a target, such as a circuit board. The flow control device provides a screen and baffle that control the flow pattern of molten solder to the nozzle so as to result in a near-parallel solder wave above the nozzle. The screen includes a pair of spaced-apart parallel panels that are disposed upstream of the nozzle. Each of the panels has apertures through which the molten solder flows before entering the nozzle. The apertures of the panels are offset from each other, such that none of the apertures are coaxial but instead overlap each other when superimposed. The baffle is disposed further upstream of the screen, and includes a number of fins disposed substantially perpendicular to the panels. The fins are arranged such that their lengths become progressively shorter in a direction away from the center of the baffle.
REFERENCES:
patent: 3990621 (1976-11-01), Boynton et al.
patent: 4208002 (1980-06-01), Comerford et al.
patent: 4447001 (1984-05-01), Allen et al.
patent: 4600137 (1986-07-01), Comerford
Cottingham Steven William
Crothers Robert Arnold
Davies Maxwell Geoffrey
Pugh Stanley James
Spaulding Frank Clyde
Delco Electronics Corporation
Funke Jimmy L.
Heinrich Samuel M.
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