Directed gas injection apparatus for semiconductor processing

Details Directed gas injection apparatus for semiconductor processing Directed gas injection apparatus for semiconductor processing

2006-09-05

2006-09-05

Picard, Leo (Department: 2125)

Data processing: generic control systems or specific application

Specific application, apparatus or process

Product assembly or manufacturing

C700S121000, C700S123000, C118S716000, C118S719000, C118S720000, C438S689000

Reexamination Certificate

active

07103443

ABSTRACT:
A method and system for utilizing a gas injection plate comprising a number of shaped orifices (e.g., sonic and simple orifices, and divergent nozzles) in the gas inject system as part of a plasma processing system. By utilizing the shaped orifices, directionality of gas flow can be improved. This improvement is especially beneficial in high aspect ratio processing.

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patent: 6136725 (2000-10-01), Loan et al.
patent: 6352594 (2002-03-01), Cook et al.
patent: 6393334 (2002-05-01), Lewis et al.

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