Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2006-11-21
2010-02-02
Sefer, A. (Department: 2893)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S714000, C257SE23087, C257SE23091, C257SE23095, C257S713000, C257S715000, C257SE23080, C257SE23090, C438S122000, C438S121000
Reexamination Certificate
active
07656025
ABSTRACT:
The semiconductor package as well as a method for making it and using it is disclosed. The semiconductor package comprises a semiconductor chip having at least one heat-generating semiconductor device and a volumetrically expandable chamber disposed to sealingly surround the semiconductor chip, the volumetrically expandable chamber filled entirely with a non-electrically conductive liquid in contact with the semiconductor device and circulated within the volumetrically expandable chamber at least in part by the generated heat of the at least one semiconductor device to cool the at least one semiconductor device.
REFERENCES:
patent: 4694378 (1987-09-01), Nakayama et al.
patent: 4949164 (1990-08-01), Ohashi et al.
patent: 5305184 (1994-04-01), Andresen et al.
patent: 5373417 (1994-12-01), Barrett
patent: 6317326 (2001-11-01), Vogel et al.
patent: 6413800 (2002-07-01), Kyle
patent: 7289326 (2007-10-01), Heydari et al.
Prof. Avram Bar-Cohen, Thermal Packaging for the 21stCentury: Challenges and Options, Oct. 3-6, 1999, Laboratory for Thermal Management of Electronics Department of Mechanical Engineering, University of Minnesota.
Joseph A. Ciccio and Rudolf E. Thun, Fellow, IEEE, Ultra-High Density VLSI Modules, Sep. 3, 1978, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. CHMT-1.
Dan's Data, The Art of Senfu, Oct. 18, 2006, http:/ /www.dansdata.com/senfu.htm.
Bunch Ernest E.
Laquer Andrew G.
Gates & Cooper LLP
Sefer A.
The Boeing Company
Woldegeorgis Ermias
LandOfFree
Direct semiconductor contact ebullient cooling package does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Direct semiconductor contact ebullient cooling package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Direct semiconductor contact ebullient cooling package will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4165846