Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area
Reexamination Certificate
2011-08-16
2011-08-16
Van, Luan (Department: 1724)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating selected area
C205S136000, C204S22400M
Reexamination Certificate
active
07998330
ABSTRACT:
Disclosed herein are electrochemical fabrication platforms for making structures, arrays of structures and functional devices having selected nanosized and/or microsized physical dimensions, shapes and spatial orientations. Methods, systems and system components use an electrochemical stamping tool such as solid state polymeric electrolytes for generating patterns of relief and/or recessed features exhibiting excellent reproducibility, pattern fidelity and resolution on surfaces of solid state ionic conductors and in metal. Electrochemical stamping tools are capable high throughput patterning of large substrate areas, are compatible with commercially attractive manufacturing pathways to access a range of functional systems and devices including nano- and micro-electromechanical systems, sensors, energy storage devices, metal masks for printing, interconnects, and integrated electronic circuits.
REFERENCES:
patent: 4968390 (1990-11-01), Bard et al.
patent: 5641391 (1997-06-01), Hunter et al.
patent: 5837157 (1998-11-01), Kohjiya et al.
patent: 6165705 (2000-12-01), Danosh et al.
patent: 6294450 (2001-09-01), Chen et al.
patent: 6555945 (2003-04-01), Baughman et al.
patent: 6782179 (2004-08-01), Bozhevolnyi et al.
patent: 2003/0044687 (2003-03-01), Noda et al.
patent: 2005/0023148 (2005-02-01), Lockard et al.
patent: 2005/0285096 (2005-12-01), Kozicki
patent: 2006/0249391 (2006-11-01), Jin et al.
patent: 2007/0215480 (2007-09-01), Fang et al.
patent: WO 2007/106911 (2007-09-01), None
Office Action, Corresponding to U.S. Appl. No. 11/376,908, Mailed Sep. 4, 2009.
Office Action, Corresponding to U.S. Appl. No. 11/376,908, Mailed Feb. 2, 2010.
Office Action, Corresponding to U.S. Appl. No. 11/376,908, Mailed Sep. 7, 2010.
Response to Office Action, corresponding to U.S. Appl. No. 11/376,908, filed Jan. 4, 2010.
Response to Office Action, corresponding to U.S. Appl. No. 11/376,908, filed Jul. 1, 2010.
Avouris et al. (Jul. 14, 1997) “Atomic Force Microscope Tip-Induced Local Oxidation of Silicon: Kinetics, Mechanism, and Nanofabrication,”Appl. Phys. Lett. 71(2):285-287.
Bhattacharyya et al. (2001) “Electrochemical Micro-Machining: New Possibilities for Micro-Manufacturing,”J. Mater. Process. Technol. 113:301-305.
Bozhevolnyi et al. (Mar. 23, 2006) “Channel Plasmon Subwavelength Waveguide Components Including Interferometers and Ring Resonators,”Nature440:508-511.
Chou et al. (Nov./Dec. 1996) “Nanoimprint Lithography,”J. Vac. Sci. Technol. B. 14(6):4129-4133.
Chou et al. (Nov./Dec./1997) “Sub-10nm Imprint Lithography and Applications,”J. Vac. Sci. Technol. B15(6):2897-2904.
Chou et al. (Apr. 5, 1996) “Imprint Lithography with 25-Nanometer Resolution,”Science272:85-87.
Dong et al. (2003) “Development of a High-Speed 3-Axis Machine Tool Using a Novel Parallel-Kinematics X-Y Table,”Int. J. Machine Tools Maufac.
Ebbesen et al. (Feb. 12, 1998) “Extraordinary Optical Transmission Through Subwavelength Hole Arrays,”Nature391:667-669.
Fang et al. (Apr. 22, 2005) “Sub-Diffraction-Limited Optical Imaging with a Silver Superlens,”Science308:534-537.
Fang et al. (2008) “Solid-State Superionic Stamping,” Power Point Presentation, Presented at the Industrial Advisory Board Meeting of NanoCEMMS, Mar. 2008.
Hans, R. (1982) “Reaction of Silver with Liquid Lulfur at 400° C.,” In;Electrochemistry of Solids, Springer-Verlag, Berlin Heidelberg, New York, pp. 165-166.
Hebb, M. (Jan. 1952) “Electrical Conductivity of Silver Sulfide,”J. Chem. Phys. 20(1):185-190.
Ho et al. (Jul. 26, 2005) “Electrolytic Transport Through a Synthetic Nanometer-Diameter Pore,”Proc. Nat. Acad. Sci. USA102(30):10445-10450.
Hsu et al. (Nov. 2006) Direct Nanopatterning with Solid Ionic Stamping, ASME IMECE, Chicago, IL Nov. 5-10.
Hsu et al. (Nov. 2006) “A Solid Phase Electrochemical Nanoimprint Process,” Paper p-35, Nanoimprint and Nanoprint Technology Conference, Nov. 15-17 San Francisco, CA.
Hsu et al. (Web Release Jan. 26, 2007) “Electrochemical Nanoimprinting with Solid-State Superionic Stamps,”Nano Lett. 7(2):446-451.
Hull, S. (Jun. 14, 2004) “Superionics: Crystal Structures and Conduction Processes,”Rep. Prog. Phys. 67:1233-1314.
Hüsser et al. (Nov. 1988) “High-Resolution Deposition and Etching of Metals with a Scanning Electrochemical Microscope,”J. Vac. Sci. Technol. B. 6(6):1873-1876.
International Search Report and Written Opinion Corresponding to International Application No. PCT/US07/64132, Mailed Jan. 29, 2008.
International Assessment of Research and Development in Micromanufacturing (2005) http://www.wtec.org/micromfg/report/Micro-report.pdf.
Kaeriyama et al. (Jan. 2005) “A Nonvolatile Programmable Solid-Electrolyte Nanometer Switch,”IEEE J. Solid-State Circ. 40(1):168-176.
Kamada et al. (Web Release Mar. 24, 2005) “Solid-Sate Electrochemical Micromachining,”Chem. Mater. 17:1930-1932.
Kashida et al. (2003) “Electronic Structure of Ag2S, Band Calculation and Photoelectron Spectroscopy,”Solid State Ionics:167-175.
Lee et al. (Oct. 18, 2004) “Electrochemical Nanopatterning of Ag on Solid-State Ionic Conductor RbAg4I5 Using Atomic Force Microscopy,”Appl. Phys. Lett. 85(16):3552-3554.
Lim et al. (2004) “Preparation of Ag2S Nanocrystals of Predictable Shape and Size,”Angew. Chem. Int. Ed. 43:5685-5689.
Lin et al. (1997) “Automated Selection of Cutting Tools Based on Solid Models,”J. Mater. Process. Technol. 72:317-329.
Mair et al. (Nov. 2005) “Nanoionics: Ion Transport and Electrochemical Storage in Confined Systems,”Nat. Mater. 4:805-815.
Matsui et al. (1978) “Inorganic Copper Ion Conductors,” In;Solid Electrolytes General Principles, Characterization, Materials and Applications, Hagenmuller et al Eds., Academic Press, pp. 237-252.
Mullin et al. (Jul. 28, 1997) “Use of Solid Electrolytic Erosion for Generating Nano-Aperture Near-Field Collectors,”Appl. Phys. Lett. 71(4):437-439.
O'Brien et al. (2002) “Magnetic Activity at Infrared Frequencies in Structures Metallic Photonic Crystals,”J. Phys. Cond. Matt. 14:6383-6394.
Park et al. (2003) “Etch Characteristics of Silver by Inductively Coupled Fluorine-Based Plasma,”Thin Solid Films445:138-143.
Prinz et al. (Oct. 18, 2004) “Electrochemical Nanopatterning of Ag on Solid-State Ionic Conductor RbAg4I5Using Atomic Force Microscopy,”App. Phys. Lett. 85(16):3552-3554.
Rynders et al. (May 1994) “Use of In Situ Atomic Force Microscope to Image Copper Electrodeposits on Platinum,”J. Electrochem. Soc. 141(15):1166-1173.
Sata et al. (Dec. 2000) “Mesoscopic Fast Ion Conduction in Nanometre-Scale Planar Heterostructures,”Nature408:946-949.
Schultz (Nov./Dec. 2007) “Solid-State Electrochemical Nanoimprinting of Copper,”Journal of Vacuum Science and Technology B, 25(6):2149-2424.
Schuster et al. (Jun. 22, 1998) “Nanoscale Electrochemistry,”Phys. Rev. Lett. 80(25):5599-5602.
Schuster et al. (Jul. 7, 2000) “Electrochemical Micromachining,”Science289:98-101.
Shahinpoor et al. (2004) “Ionic Polymer-Metal Composites: III. Modeling and Simulation as Biomimetic Sensors, Actuators, Transducers, and Artificial Muscles,”Smar. Mater. Struct. 14:197-.
Tan et al. (2004) “Current Status of Nanonex Nanoimprint Solutions,” http://www.nanonex.com/technology.htm.
Tennant, D.M. (Apr./Jun. 1983) “Metal on Polymer Ion Implantation Mask,”J. Vac. Sci. Technol. B1(2):494-496.
Terabe et al. (Jan. 6, 2005) “Quantized Conductance Atomic Switch,”Nature433:47-50.
Terabe et al. (Jun. 14, 2002) “Formation and Disappearance of a Nanoscale Silver Cluster Realized by Solid Electrochemical Reaction,”J. Appl. Phys. 91(12):10110-10114.
Terabe et al. (May 27, 2002) “Ionic /
Fang Nicholas X.
Ferreira Placid M.
Hsu Keng Hao
Jacobs Kyle E.
Kumar Anil
Greenlee Sullivan P.C.
The Board of Trustees of the University of Illinois
Van Luan
LandOfFree
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