Direct metallization process

Details Direct metallization process Direct metallization process

1995-06-07

1997-11-25

Gorgos, Kathryn L.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

205125, 205159, 205162, 205163, 205164, 205166, 205183, 427 97, 216 18, C25D 502, C25D 554, C25D 556, B05D 512

Patent

active

056908059

ABSTRACT:
A method of applying a conductive carbon coating to a non-conductive layer, conductive carbon compositions, and a printed wiring board having through holes or other surfaces treated with such carbon compositions are disclosed. A board or other substrate including at least first and second electrically conductive metal layers separated by a non-conductive layer is provided. The board has a recess extending through at least one of the metal layers into the non-conductive layer. The recess has a non-conductive surface which is desired to be made electrically conductive. The carbon in the dispersion has a mean particle size no greater than about 50 microns. The method is carried out by applying the carbon dispersion to a non-conductive surface of the recess to form a substantially continuous, electrically conductive carbon coating. Optionally, the coating is then fixed, leaving the carbon deposit as a substantially continuous, electrically conductive layer. Chemical and physical fixing steps are disclosed. The resulting coating has a low electrical resistance and is tenacious enough to be plated and exposed to molten solder without creating voids or losing adhesion.

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