Direct metallization process

Details Direct metallization process Direct metallization process

1991-10-15

1994-12-27

Niebling, John

Chemistry: electrical and wave energy

Processes and products

Electrostatic field or electrical discharge

204125, 204166, C25D 556

Patent

active

053762487

ABSTRACT:
A direct metallization process is disclosed wherein plastic substrates may be electrolytically plated without the need for any prior electroless plating. The process uses a specially formulated post-activator composition at an elevated temperature to treat the activated substrate comprising either an alkaline solution containing an effective amount of metal ions which undergo a disproportionation reaction or an alkaline solution containing a metal ion such as Cu.sup.+2.

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patent: 4171225 (1979-10-01), Molenaar et al.
patent: 4895739 (1990-01-01), Bladon
patent: 5213841 (1993-05-01), Gulla et al.
F A Lowenheim, Electroplating, McGraw-Hill Book Co., New York, 1978, pp. 404-405, 418-423.
A. Molenaar et al, Autocatalytic Deposition of Tin, J. Electrochem. Soc., vol. 136, No. 2, Feb. 1989, pp. 378-382.

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