Direct-manufactured duct interconnects

Details Direct-manufactured duct interconnects Direct-manufactured duct interconnects

2006-06-02

2009-11-24

Patel, Ramesh B (Department: 2121)

Data processing: generic control systems or specific application

Specific application, apparatus or process

Product assembly or manufacturing

C700S098000, C700S118000, C700S163000, C700S182000, C703S001000, C138S111000, C138S113000, C174S0720TR, C174S098000, C285S331000, C285S363000, C285S364000

Reexamination Certificate

active

07623940

ABSTRACT:
A method for forming a duct interconnect generally includes providing a digital model of a first duct structure and a second duct structure, the first duct structure including a first duct section having a passage for conveying a substance and an interconnect component moveably and captively coupled to the duct section. The second duct structure includes a second duct structure and a second interconnect component. The process includes forming, via a direct manufacturing procedure (e.g., stereolithography), a physical model of the first duct and second structures in accordance with the digital models, wherein the interconnect component has a locked and unlocked state, and wherein the unlocked state corresponds to a predetermined compressive force between the first duct structure and a second duct structure.

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EPO Search Report for GB0710642.0, Aug. 3, 2007, The Boeing Company.

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