Direct interconnection for use between a semiconductor and a pin

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Details

357 70, 357 65, H01L 2348

Patent

active

048665045

ABSTRACT:
A direct device-to-connector interconnection includes a plurality of conductive strips affixed to a support member, each strip being cooperatively sized and aligned to establish a direct fanned out connection between a bonding pad and an external connector.

REFERENCES:
patent: 4387388 (1983-07-01), Zakhariya
patent: 4472876 (1984-09-01), Nelson

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