Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1993-05-04
1995-07-25
Bishop, Steven C.
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
257730, 257778, 361744, 385 14, 439 71, H01L 2350, H01R 909
Patent
active
054357349
ABSTRACT:
A system for directly connecting one integrated circuit to another achieved by depositing gold onto the bonding pads of both integrated circuits, aligning the respective bonding pads and biasing both circuits into gas-tight, electrically conductive relation through the use of an initial compression force and a spring assembly. The gold bumps deposited on the bonding pads include ridges to ensure an optimal gas-tight seal. Alignment posts are also inserted through the host integrated circuit, which match notches cut into the periphery of the target integrated circuit, to ensure proper polarization and mating of the bonding pads of each integrated circuit. The integrated circuits and spring assembly are housed, and thus held together by, a carrier assembly. The carrier assembly also serves to dissipate heat generated by the integrated circuits, adapts for mounting on a printed circuit board, and includes a ferrule over an optical sensing area provided on the host integrated circuit.
REFERENCES:
patent: 3239719 (1966-03-01), Shower
patent: 3757127 (1973-09-01), Dhaka
patent: 4373778 (1983-02-01), Adham
patent: 4466184 (1984-08-01), Cuneo et al.
patent: 4565314 (1986-01-01), Scholz
patent: 4575820 (1986-03-01), Barditch
patent: 4595794 (1986-06-01), Wasserman
patent: 4674834 (1987-06-01), Margolin
patent: 4754316 (1988-06-01), Reid
patent: 4813129 (1989-03-01), Karnezos
patent: 4872089 (1989-10-01), Ocken et al.
patent: 4875617 (1989-10-01), Citowsky
patent: 4878990 (1989-11-01), Dugan et al.
patent: 4916806 (1990-04-01), Lorenzen
patent: 4930001 (1990-05-01), Williams
patent: 4949148 (1990-08-01), Bartelink
patent: 4953061 (1990-08-01), Nitkiewicz
patent: 5010389 (1991-04-01), Gansauge et al.
patent: 5046953 (1991-09-01), Shreeve et al.
patent: 5065282 (1991-11-01), Polonio
patent: 5083007 (1992-01-01), Spletter et al.
patent: 5258858 (1993-11-01), Chow
Exhibit A is an article on new computer board, packaging, and connector designs published in EDN Magazine on Jul. 5, 1990.
Exhibit B is an article on engineering composite materials published in Electronic Engineering Times on Mar. 20, 1989.
Exhibit C is part of an article on three-dimensional computer architecture published in Electronic Engineering Times on Sep. 24, 1990.
Exhibit D is part of an article on three-dimensional packaging architecture published in Electronic Engineering Times on Apr. 16, 1990.
Exhibit E is an advertisement for multilayer composite chip technology offered by TDK Corp. of America, published in EDN magazine on Apr. 28, 1990.
Exhibit F is part of an article on multichip modules published in Electronic Engineering Times on May 21, 1990.
Exhibit G is an advertisement for application specific hybrids offered by Phillips Circuit Assemblies, published in Electronic Engineering Times' 1990 Annual Report.
Exhibit H is part of an article on electron microscope technology for use with multichip module designs, published in Electronic Engineering Times.
"Magnetically Secured Integrated Circuit Package", by D. C. Landwer. Western Electric Technical Digest, No. 28 (Oct., 1972), pp. 25-26.
"Chip-Module (Board) Package for High Speed Computer Technology" by N. Breslau, IBM Technical Disclosure Bulletin, vol. 20, No. 11A (Apr., 1978), p. 4655.
"Chip-To-Chip Mounting System", IBM Technical Disclosure Bulletin, vol. 31, No. 2 (Jul., 1988), pp. 340-341.
LandOfFree
Direct integrated circuit interconnector system does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Direct integrated circuit interconnector system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Direct integrated circuit interconnector system will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-736758