Direct-gap germanium-tin multiple-quantum-well electro-optical d

Active solid-state devices (e.g. – transistors – solid-state diode – Thin active physical layer which is – Heterojunction

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257 19, 257103, 257190, 257201, 257616, H01L 2906, H01L 3300, H01L 310328, H01L 31117

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active

055481280

ABSTRACT:
Silicon-based laser diodes, optical amplifiers, electrooptical modulators, and photodetectors in which the active region consists of a pseudomorphic GeSn multiple quantum well stack. Each quantum well is tensile-strained Ge.sub.1-x Sn.sub.x layer sandwiched between compressively strained barriers of Ge.sub.1-y Sn.sub.y with x.about.0.1, x<y and y.about.0.15. The GeSn quantum wells have a strain-induced direct gap for strongly allowed band-to-band transitions in the infrared range. The quantum well stack is grown upon a relaxed SiGeSn alloy buffer portion whose composition is graded up from a lattice match at the silicon substrate interface to a Ge or GeSn composition at buffer's top surface. Doped cladding layers are added, so that the devices have a p-i-n diode structure. The monolithic integrated Column IV devices have a rib waveguide structure, where desired, and operate typically in the 2 to 3 micron wavelength range.

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patent: 5107538 (1992-04-01), Benton et al.
patent: 5173913 (1992-12-01), Kaneno
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