Direct facility water test head cooling architecture

Details Direct facility water test head cooling architecture Direct facility water test head cooling architecture

2007-03-08

2009-06-30

Patel, Paresh (Department: 2829)

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

C324S760020

Reexamination Certificate

active

07554323

ABSTRACT:
An apparatus is provided to cool high-performance instruments within a semiconductor test head using direct facility water. The direct facility water cooling apparatus consists of an air chamber, a first base to receive and removably mount the instrument within the air chamber, a test head inlet in fluid communication with the first base and a facility water supply, a test head discharge in fluid communication with the first base and a facility drain, and a fan in fluid communication with the air chamber inlet to induce the flow of air from the air chamber inlet to the air chamber outlet.

REFERENCES:
patent: 4862075 (1989-08-01), Choi et al.
patent: 5307018 (1994-04-01), Gadgil
patent: 5510958 (1996-04-01), Shimabara et al.
patent: 5644248 (1997-07-01), Fujimoto
patent: 5889651 (1999-03-01), Sasaki et al.

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