Direct etch processes for the manufacture of high density module

Details Direct etch processes for the manufacture of high density module Direct etch processes for the manufacture of high density module

1996-03-11

1997-08-26

Powell, William

Etching a substrate: processes

Forming or treating electrical conductor article

Forming or treating of groove or through hole

216 39, 216 41, B44C 122

Patent

active

056607385

ABSTRACT:
The process of the manufacture of both the conductive layers and dielectric layers of multichip modules of the deposited variety is set forth with direct etch techniques being substituted for photolithography. Simply stated, entire circuit layers of the modules are directly etched or patterned with the circuit configuration required. Three processes are disclosed for processing the individual layers including subtractive patterning of a metallic conductor layer and direct patterning of the dielectric layer; direct etch metal processing (DEMI) involving direct removal of the metal layer with subsequent direct patterning of the dielectric layer; and, plating form process involving additive metallization and direct etching of the dielectric layer. By utilizing the disclosed processes alone or in combination, fabrication of multichip modules can occur.

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