Direct electroplating of through holes

Chemistry: electrical and wave energy – Processes and products

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204 20, 204 26, C25D 502, C25D 504

Patent

active

049699792

ABSTRACT:
Substantially nonconductive or semiconductive surfaces of through holes can be electroplated directly, without an intervening non-electrolytic metallization, by a stepwise process which includes the application to the through holes of a polyelectrolyte surfactant in solution in combination with the application of a conductive metal containing material.

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