Direct electrolytic metallization on non-conducting substrates

Details Direct electrolytic metallization on non-conducting substrates Direct electrolytic metallization on non-conducting substrates

2006-04-11

2006-04-11

Wong, Edna (Department: 1753)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating predominantly nonmetal substrate

C205S162000, C205S164000, C205S125000, C205S210000

Reexamination Certificate

active

07025867

ABSTRACT:
The invention relates to a method for the direct electrolytic metallization of electrically non-conducting substrate surfaces comprising bringing the substrate surfaces into contact with a water-soluble polymer; treating the substrate surfaces with a permanganate solution; treating the substrate surfaces with an acidic aqueous solution or an acidic microemulsion of aqueous base containing at least one thiophene compound and at least one alkane sulfonic acid selected from the group comprising methane sulfonic acid, ethane sulfonic acid and ethane disulfonic acid; electrolytically metallizing the substrate surfaces.

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Bressel, et al., “ Handluch der Leiterplattentechnik” vol. 3 (1993) Hermann, pp. 80-89.

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