Direct dipping cooled power module and packaging

Details Direct dipping cooled power module and packaging Direct dipping cooled power module and packaging

2011-03-22

2011-03-22

Datskovskiy, Michael V (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S679530, C361S698000, C361S707000, C361S708000, C257S686000, C257S714000, C165S080400, C165S080500, C165S104190

Reexamination Certificate

active

07911792

ABSTRACT:
A power module package including a fully enclosed package comprising sidewalls; wherein at least one of said sidewalls includes a conductive substrate; wherein circuit elements are mounted on said conductive substrate on a first side comprising an inner side of said enclosed package; and, wherein a majority area of a second side of said conductive substrate is exposed, the power package has an improved interconnection configuration and compact power I/O terminals, offering low electrical parasitics, a plurality of individual power module packages can be attached seamlessly and positioned in a liquid coolant with multiple top portion open channels, as well as attached to a laminar power connector (busbar) to form various electrical power conversion topologies, the module offers low thermal resistance and low electrical parasitics, in addition to small volume, light weight and high reliability.

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