Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Having light transmissive window
Reexamination Certificate
2007-10-23
2007-10-23
Parekh, Nitin (Department: 2811)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Having light transmissive window
C438S025000, C438S026000, C438S030000, C438S508000, C257S680000, C257S714000
Reexamination Certificate
active
11423918
ABSTRACT:
A thermal management system is provided for semiconductor devices such as an LED array, wherein coolant directly cools the LED array. Preferably, the coolant may be selected, among other bases, based on its index of refraction relative to the index associated with the semiconductor device.
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Anderson Duwayne R.
Owen Mark D.
Vlach Francois
Ganz Law P.C.
Parekh Nitin
Phoseon Technology, Inc.
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