Direct-contact type image sensor using optical fiber array with

Details Direct-contact type image sensor using optical fiber array with Direct-contact type image sensor using optical fiber array with

1993-12-02

1995-09-05

Nelms, David C.

Radiant energy

Photocells; circuits and apparatus

Photocell controlled circuit

358484, H01J 4014

Patent

active

054480558

ABSTRACT:
The present invention provides a direct-contact type image sensor device in which an image sensor chip having electrodes and a photosensitive element array is mounted on an optical fiber array plate by a flip-chip-bonding method. The optical fiber array plate includes a first opaque substrate, a second opaque substrate, an optical fiber array formed by arranging a plurality of optical fibers, and a transparent member disposed in contact with a side face of the optical fiber array, the optical fiber array and the transparent member being interposed between the first and second opaque substrates. Each of the plurality of optical fibers includes a center core, a clad provided on an outer surface of the core, and a light absorbing layer provided on an outer surface of the clad. The image sensor chip is provided in such a way that the photosensitive element array is disposed along an upper end of the optical fiber array and in a portion of the optical fiber array plate except the transparent member, the transparent member forming a slit for transmitting light.

REFERENCES:
patent: 5032718 (1991-07-01), Murakami
patent: 5038027 (1991-08-01), Ioka
patent: 5052776 (1991-10-01), Fukushima et al.
patent: 5065006 (1991-11-01), Nakamura et al.
patent: 5081347 (1992-01-01), Matsumoto
patent: 5138145 (1992-08-01), Nakamura et al.
patent: 5187596 (1993-02-01), Hwang
patent: 5266828 (1993-11-01), Nakamura et al.
patent: 5319731 (1994-06-01), Eastman

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