Direct contact type image sensor and its production method

Details Direct contact type image sensor and its production method Direct contact type image sensor and its production method

1995-06-07

1998-11-10

Garber, Wendy R.

Television

Camera, system and detail

Optics

348359, 348374, 2502081, H04N 5225

Patent

active

058351426

ABSTRACT:
A direct contact type image sensor includes an optical fiber array plate including a transparent substrate and an optical fiber array and having a lower face brought into close contact with an original document. A semiconductor image sensor chip including a photosensor array is mounted on an upper face of the optical fiber array plate by transparent photo-setting and insulating resin. A circuit conductive layer is formed on an upper face of the transparent substrate, and a bump electrode is formed on a lower face of the semiconductor image sensor chip so as to be brought into contact with the circuit conductive layer. A light source is provided for illuminating the original document. The optical fiber array plate is formed, on the upper face, with a slit for allowing light from the light source to pass therethrough. A first light shielding layer is provided at other portions of the lower face of the optical fiber array plate than that corresponding to the optical fiber array, and a second light shielding layer is provided at other portions of the upper face of the optical fiber array plate than those corresponding to the optical fiber array and the slit.

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