Direct contact power transfer pad and method of making same

Details Direct contact power transfer pad and method of making same Direct contact power transfer pad and method of making same

2004-09-20

2008-08-26

Reichard, Dean A. (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C361S771000, C361S772000, C361S774000, C361S777000, C361S794000

Reexamination Certificate

active

07417197

ABSTRACT:
A power transfer pad, having: a non-conductive board having a top and a bottom; a plurality of conductive substrate sections disposed across the top of the non-conductive board; at least one conducting element disposed on each of the conductive substrate sections; a plurality of electrical contacts on the bottom of the non-conductive board, wherein each of the electrical contacts on the bottom of the non-conductive board are in electrical communication with one of the conductive substrate sections on the top of the non-conductive board.

REFERENCES:
patent: 4632857 (1986-12-01), Mallory, Jr.
patent: 4778950 (1988-10-01), Lee et al.
patent: 4933810 (1990-06-01), Cardashian et al.
patent: 6210781 (2001-04-01), Baum et al.
patent: 6224388 (2001-05-01), Ahr et al.
patent: 6459032 (2002-10-01), Luch
patent: 6541147 (2003-04-01), McLean et al.
patent: 6913477 (2005-07-01), Dayan et al.
International Search Report, Dec. 8, 2006, PCT.

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