Direct connect interconnect for testing semiconductor dice and w

Details Direct connect interconnect for testing semiconductor dice and w Direct connect interconnect for testing semiconductor dice and w

1997-03-17

2000-02-15

Ballato, Josie

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324757, G01R 0173

Patent

active

06025730&

ABSTRACT:
An interconnect and system for testing semiconductor dice, and a test method using the interconnect are provided. The interconnect includes a substrate having patterns of contact members for electrically contacting the dice. The interconnect also includes patterns of conductors for providing electrical paths to the contact members. In addition, the interconnect includes contact receiving cavities configured to retain electrical connectors of a testing apparatus in electrical communication with the conductors. A die level test system includes the interconnect mounted to a temporary package for a singulated die. In the die level test system, the interconnect provides direct electrical access from testing circuitry to the die. A wafer level test system includes the interconnect mounted to a probe card fixture of a wafer probe handler. In the wafer level test system, the contact receiving cavities can be configured to support and align the interconnect to the probe card fixture.

REFERENCES:
patent: 4891585 (1990-01-01), Janko et al.
patent: 4906920 (1990-03-01), Huff et al.
patent: 4918383 (1990-04-01), Huff et al.
patent: 5006792 (1991-04-01), Malhi et al.
patent: 5073117 (1991-12-01), Malhi et al.
patent: 5123850 (1992-06-01), Elder et al.
patent: 5124639 (1992-06-01), Carlin et al.
patent: 5172050 (1992-12-01), Swapp
patent: 5180977 (1993-01-01), Huff
patent: 5264787 (1993-11-01), Woith et al.
patent: 5302891 (1994-04-01), Wood et al.
patent: 5322446 (1994-06-01), Cearley-Cabbiness
patent: 5367253 (1994-11-01), Wood et al.
patent: 5408190 (1995-04-01), Wood et al.
patent: 5418471 (1995-05-01), Kardos
patent: 5420520 (1995-05-01), Anschel et al.
patent: 5424652 (1995-06-01), Hembree et al.
patent: 5440240 (1995-08-01), Wood et al.
patent: 5451165 (1995-09-01), Cearley-Cabbiness
patent: 5483174 (1996-01-01), Hembree et al.
patent: 5483741 (1996-01-01), Akram et al.
patent: 5517125 (1996-05-01), Posedel et al.
patent: 5530376 (1996-06-01), Lim et al.
patent: 5541525 (1996-07-01), Wood et al.
patent: 5543725 (1996-08-01), Lim et al.
patent: 5559446 (1996-09-01), Sano
patent: 5592736 (1997-01-01), Akram et al.
patent: 5600259 (1997-02-01), Baryzel
patent: 5686317 (1997-11-01), Akram et al.
patent: 5691649 (1997-11-01), Farnworth et al.
patent: 5731709 (1998-03-01), Pastore et al.
patent: 5783461 (1998-07-01), Hembree
patent: 5815000 (1998-09-01), Farnworth et al.
patent: 5834945 (1998-11-01), Akram et al.
patent: 5844418 (1998-12-01), Wood et al.
patent: 5878485 (1999-03-01), Wood et al.
patent: 5896036 (1999-04-01), Wood et al.
patent: 5915977 (1999-06-01), Hembree et al.
patent: 5929647 (1999-07-01), Akram et al.

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