Direct chip attachment method

Details Direct chip attachment method Direct chip attachment method

1997-05-16

1999-03-30

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

29721, 29840, 156 64, 356400, H05K 330

Patent

active

058873430

ABSTRACT:
A method is for making a chip package of a type including a carrier and a chip connected thereto using optical alignment techniques. One method includes the steps of: providing a transparent film having chip alignment and carrier alignment indicia thereon, optically detecting the chip through the transparent film and aligning the transparent film and the chip based upon the chip alignment indicia. Similarly, the method may include optically detecting the carrier through the transparent film and aligning the transparent film and the carrier based upon the carrier alignment indicia. In addition, the method further includes securing the chip, transparent film and carrier together, such as by providing a thermoplastic transparent film which may heated for adhesively securing the components. The transparent film may be a transparent z-axis conductive film, or a dielectric transparent film. The dielectric transparent film may be a z-axis anisotropic dielectric transparent film, or openings may be formed in the dielectric film and filled with conductive material to establish electrical contact between the chip and carrier pads.

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