Direct chip attachment (DCA) with electrically conductive adhesi

Details Direct chip attachment (DCA) with electrically conductive adhesi Direct chip attachment (DCA) with electrically conductive adhesi

1996-04-09

1998-05-05

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 97, 427282, 22818022, 29874, 29884, B05D 512

Patent

active

057471010

ABSTRACT:
A simple process for card assembly by Direct Chip Attachment (DCA) uses electrically conductive adhesives. Two methods create the same intermediate wafer product with a layer of insulative thermoplastic and conductive thermoplastic bumps. After sawing or dicing the wafer to form the chips, the chips are adhered to chip carriers with conductive pads which match the conductive thermoplastic bumps, using heat and pressure. Chips may be easily removed and replaced using heat.

REFERENCES:
patent: 4600600 (1986-07-01), Pammer et al.
patent: 4604644 (1986-08-01), Beckham et al.
patent: 5086558 (1992-02-01), Grube et al.
patent: 5124781 (1992-06-01), Tashiro
patent: 5356838 (1994-10-01), Kim
patent: 5550408 (1996-08-01), Kunimoto et al.
patent: 5583747 (1996-12-01), Baird et al.

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