Direct bonding of ceramic parts by a silver alloy solder

Details Direct bonding of ceramic parts by a silver alloy solder Direct bonding of ceramic parts by a silver alloy solder

1989-07-07

1990-12-25

Zimmerman, John J.

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

428673, 428457, 420501, B32B 1504, C22C 506

Patent

active

049802437

ABSTRACT:
Solders for directly soldering together ceramic parts consisting essentially of 70 to 99% silver, 0.5 to 15% by weight indium or 0.5 to 10% by weight tin and 0.5 to 15% by weight titanium or zirconium, or mixtures thereof. These solders are very ductile, are workable at comparatively low temperatures and provide very firm bonding.

REFERENCES:
patent: 4471026 (1984-09-01), Nicholas et al.
patent: 4621761 (1986-11-01), Hammond et al.
patent: 4623513 (1986-11-01), Mizuhara
patent: 4630767 (1986-12-01), Mizuhara
patent: 4667871 (1987-05-01), Mizuhara
patent: 4711386 (1987-12-01), Mizuhara
patent: 4785989 (1988-11-01), Mizuhara
Nesse, T., "Untersuchungen zum Aktivloeten von Keramik und Graphit", Metall, Mar. 1973, pp. 259-265.

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