Direct bond copper-output footprint

Details Direct bond copper-output footprint Direct bond copper-output footprint

1993-09-09

1994-06-28

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

29830, 437209, 361808, H01L 2302

Patent

active

053248902

ABSTRACT:
The invention includes a flat, planar, single piece copper footprint including a first portion for mounting an aluminum bond pad, and a third portion for mounting a semi-conductor device, and a second portion, interposed between the first and third portions, which is recessed and includes arcuate-shaped sides. The recessed arcuate-shaped sides of the second portion of the copper footprint act as a solder stop preventing solder from flowing from the first portion to the third portion or vice versa.

REFERENCES:
patent: 3864014 (1975-02-01), Lynch
patent: 4288841 (1981-09-01), Gogal
patent: 4396547 (1983-08-01), Bauermans
patent: 4605153 (1986-08-01), Van Den Brekel et al.
patent: 4717347 (1988-01-01), Babow et al.
patent: 5005069 (1991-04-01), Wasmer et al.
patent: 5063665 (1991-11-01), Lamey et al.
patent: 5163856 (1992-11-01), McGaffigan et al.
patent: 5242097 (1993-09-01), Socha

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