Direct BGA socket

Details Direct BGA socket Direct BGA socket

1998-12-30

2000-08-01

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361764, 361765, 361783, 361790, 361807, 257724, 257686, 257704, 257738, 174253, 174255, 174260, 439 66, 439 68, 22818021, 22818022, H05K 702

Patent

active

060976098

ABSTRACT:
An electronic packaging assembly is disclosed. An electronic component is disposed on a socketing substrate utilizing a ball grid array or land grid array. The socketing substrate contains a series of pins that are embedded within the thickness of the socketing substrate. The pins correspond with the ball grid array or land grid array contacts of the electronic component. The socketing substrate is mounted onto a motherboard using an array of solder balls that correspond to and are disposed on, the end of the pins facing the motherboard. If desired, the electronic component may be protected by a metal lid. If desired, socketing substrates can be disposed on both sides of a motherboard.

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