Direct attachment of silicon chip to circuit carrier

Details Direct attachment of silicon chip to circuit carrier Direct attachment of silicon chip to circuit carrier

1997-11-24

1998-12-29

Niebling, John F.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

438118, 438612, 438691, 438692, 438693, H01L 2144, H01L 2148, H01L 2150, H01L 21302

Patent

active

058540938

ABSTRACT:
The present invention features a method and an article of manufacture for directly attaching silicon chips to circuit carriers. Both the method and the article of manufacture feature a dissolvable, thin wafer that is soldered first to the chip and then to the circuit board, completing the connection. The wafer article consists of embedded, spaced-apart, flexible wires that fit the connection footprints of both the chip and the carrier board. The wafer is fashioned from a matrix block having a heat-resistant, dissolvable substance which encapsulates the wires. The matrix is cut into thin slices that are wafer-thin. Each slice or wafer of the matrix carrier is then attached to a chip, using solder with an appropriate melting temperature that is thermally compatible with the chip. The solder attaches one end of the embedded wires to the chip. The other end of the wafer's wires are then matched and soldered to the wire footprint of the circuit board, using another type of solder that melts at a temperature thermally compatible with the circuit board. Afterwards, the dissolvable, encapsulating material is removed from the body of the wafer, leaving the chip attached to the circuit carrier by only the remaining, interdisposed, flexible wires. In this way a "packageless" package or an "air/copper" package is fabricated.

REFERENCES:
patent: 5032543 (1991-07-01), Black et al.
patent: 5494862 (1996-02-01), Kato et al.
patent: 5503698 (1996-04-01), Goldberg et al.
patent: 5516706 (1996-05-01), Kusakabe
patent: 5622875 (1997-04-01), Lawrence
"Three-Dimensional Discrete Wire Fan-Out Pattern", IBM Technical Disclosure Bulletin, vol. 27, No. 10A, Mar. 1985.

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