Direct attach optical receiver module and method of testing

Details Direct attach optical receiver module and method of testing Direct attach optical receiver module and method of testing

2007-05-29

2007-05-29

Tran, Dzung (Department: 2613)

Optical communications

Receiver

Heterodyne

C398S164000, C398S212000

Reexamination Certificate

active

10279719

ABSTRACT:
Optical receiver modules are used for receiving high-speed optical data signals. Unfortunately, these optical receiver modules are often tested for the first time after they are packaged in a housing. Thus significant costs are associated with those packaged devices that fail to meet predetermined criteria. An integrated optical receiver module is proposed that has an optical detector direct attached, or flip-chipped or bumped, onto an integrated circuit having an amplifier circuit. The direct attach process is performed when the integrated circuits still reside on a semiconductor wafer prior to dicing thereof. Thus, high speed optical testing of the optical receiver module is possible on a wafer level to determine actual performance characteristics thereof prior to dicing.

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