Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1997-02-28
1999-09-21
Lorin, Francis J.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156177, 156 47, B32B 3100
Patent
active
059549092
ABSTRACT:
Process of adhering conductors such as bare copper wire, copper wire with polymide insulation, and multistrand Kapton wrapped superconductors to mount structures such as a cylinder of arbitrary cross sections, a saddle support, or steel tubes using adhesive layers of material such as BONDALL 16-H, 3M-2090 and T-164. The adhesive layers are subject to b-staging before being used, where it is heated to a temperature of approximately 60-100.degree. C. for approximately 1/2 hour to approximately one hour. The support surface can optionally be grooved to allow for better wire placement and no wire slippage.
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Davidsohn Daniel
Lundy Scott
Meinke Rainer
Senti Mark W.
Stelzer Gerald
GSMA Systems, Inc.
Lorin Francis J.
Steinberger Brian S.
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