Dipping type surface treatment apparatus

Details Dipping type surface treatment apparatus Dipping type surface treatment apparatus

1991-12-27

1993-03-09

Stinson, Frankie L.

Cleaning and liquid contact with solids

Apparatus

Sequential work treating receptacles or stations with means...

1341021, 134140, 134902, B08B 302

Patent

active

051919087

ABSTRACT:
A dipping type wafer treatment apparatus includes housing having first and second openings, a wafer treatment bath provided inside the housing, a clean air unit for producing a downflow, a flow rectifier for introducing the downflow into the housing, a communicating chamber provided below the housing being partitioned from a space inside the housing, a duct for guiding mist in the vicinity of the treatment bath in the housing into the communicating chamber together with the downflow, and a pump for forcing air out of the communicating chamber from an air outlet provided in the communicating chamber.

REFERENCES:
patent: 2181177 (1939-11-01), Davis
patent: 3893869 (1975-07-01), Mayer et al.
patent: 4520834 (1985-06-01), DiCiclo
patent: 4694527 (1987-09-01), Yoshizawa
patent: 4839979 (1989-06-01), Nishida et al.

Affiliated with

Also associated with

Rating

Dipping type surface treatment apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Dipping type surface treatment apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Dipping type surface treatment apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-205283