Diplexer formed in multi-layered substrate

Wave transmission lines and networks – Plural channel systems – Having branched circuits

Reexamination Certificate

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C333S100000, C333S185000

Reexamination Certificate

active

07135943

ABSTRACT:
A lumped-element diplexer formed in a multi-layered substrate includes a high-pass filter circuit, a low-pass filter circuit, and a ground plane, the elements of the filter circuits being disposed as follows: a first capacitor plate on a first layer of the substrate connected to a first port and a first inductor plate on a third layer, a second capacitor plate on a second layer of the substrate connected to the first inductor plate and a third capacitor plate on a fourth layer, the third capacitor plate in turn being connected to a second port. A fourth capacitor plate on a fifth layer of the substrate is connected to a second inductor plate on a seventh layer, the second inductor plate in turn being connected to the ground plane on a zeroth layer. A fifth capacitor plate on a sixth layer of the substrate is connected to a third port.

REFERENCES:
patent: 5880649 (1999-03-01), Tai et al.
patent: 6097268 (2000-08-01), Watanabe et al.
patent: 6366564 (2002-04-01), Hiraka et al.
patent: 6563396 (2003-05-01), Tanaka et al.
patent: 6677833 (2004-01-01), Sheen
patent: 6734767 (2004-05-01), Vanoverschelde et al.
patent: 6876840 (2005-04-01), Shin et al.
patent: 6911708 (2005-06-01), Park
patent: 6927648 (2005-08-01), Furuya et al.

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