Dip switch having single terminal-contact support wafer

Details Dip switch having single terminal-contact support wafer Dip switch having single terminal-contact support wafer

1985-07-31

1987-02-17

Scott, J. R.

Electricity: circuit makers and breakers

Multiple circuit control

Multiple switch

200 6B, 200 6BB, H01H 1908

Patent

active

046441107

ABSTRACT:
A dual in-line package (DIP) switch includes movable terminals and fixed terminals all of which are inserted in a wafer by insert molding. The two rows of terminals have terminal portions including contact portions. The terminal portions of the two rows are disposed substantially parallel to each other and spaced apart a given distance within a casing in such a way that the corresponding contact portions can either make or break contact with each other.

REFERENCES:
patent: 3784765 (1974-01-01), Daly
patent: 3849610 (1974-11-01), Lockard et al.
patent: 3944760 (1976-03-01), Zdangs et al.
patent: 4119823 (1978-10-01), Matsueda et al.
patent: 4389549 (1983-06-01), Brown
patent: 4497983 (1985-02-01), Galloway et al.

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