Dip soldering apparatus

Metal fusion bonding – Including means to apply flux or filler to work or applicator – With means to skim dross

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Details

118422, 266228, B23K 100

Patent

active

051920140

ABSTRACT:
In a dip soldering apparatus, a first scraper blade scrapes the surface of the solder bath before a pot is raised through the surface of the bath, and a second blade then scrapes the surface of solder in the pot when the pot has been lifted through the surface. The blades are swept around in a circle to facilitate operation of the device. A rotary station for feeding components to the soldering apparatus comprises a rotatable table carrying a plurality of pneumatically operated stations to index them sequentially through operating positions. The air supply lines, for pneumatic control and operation of each station, are discrete to the respective operating positions and so it is not necessary to provide a system of supply lines which rotate with the stations. An end of a supply line is sealed to a conduit in the table by a PTFE sealing member which has an inwardly directed, tapered lip. As air pressure in the line is increased (to operate the station) the lip is urged against the underside of the table.

REFERENCES:
patent: 1783642 (1930-12-01), Ferguson et al.
patent: 2349972 (1944-05-01), Lister
patent: 4004333 (1977-01-01), Daniels
patent: 4332373 (1982-06-01), Huppunen et al.
patent: 4509670 (1985-04-01), Cammarata
patent: 4785762 (1988-11-01), Miyazaki et al.
patent: 5087356 (1992-02-01), Webb

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