Diode device packaging arrangement

Details Diode device packaging arrangement Diode device packaging arrangement

1988-04-11

1989-05-30

Gensler, Paul

Wave transmission lines and networks

Coupling networks

Balanced to unbalanced circuits

333 33, 333245, 357 81, H01P 510

Patent

active

048354953

ABSTRACT:
An arrangement for packaging an active millimeter wave device is provided having an active solid state diode mounted on a cylindrical shaped heat sink pedestal. The cap for the diode is an elongated cylindrical conductor which also serves as a portion of the center coaxial conductor and DC bias pin. A conductive annular ring is also mounted on the pedestal encircling the diode and serves as the outer coaxial conductor for the coaxial transmission line structure. Advantageously the coaxial transmission line, namely the center and outer conductors, can be precisely assembled in relation to the diode for improved impedance characteristic and efficient energy coupling. Furthermore, the elongated cap moves the point of contact with the bias pin to a region of higher RF impedance, reducing RF losses.

REFERENCES:
patent: 2933705 (1960-04-01), Hapfer
patent: 3210459 (1965-10-01), Marcinko et al.
patent: 3448415 (1969-06-01), DeLoach, Jr.
patent: 4437077 (1984-03-01), Henry et al.
patent: 4689583 (1987-08-01), Jerinic et al.

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