Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2001-01-04
2001-11-13
Picard, Leo P. (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S707000, C361S709000, C165S080100, C165S080200, C165S185000, C174S016300, C257S706000, C257S712000, C257S713000
Reexamination Certificate
active
06317327
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention relates to a diode and, more particularly, to a diode cooling arrangement, which facilitates the assembly and packing procedures and, increases the heat dissipation area.
FIG. 1
illustrates a diode cooling arrangement according to the prior art. According to this arrangement, the diode comprises a crystal
1
′, and two metal radiating fins
2
′ and
3
′ respectively soldered to two opposite end faces of the crystal
1
′. The metal radiating fins
2
′ and
3
′ each have a leg for connecting to a respective contact at a substrate. Further, one metal radiating fin
3
′ has a front mounting hole for fastening to the substrate by a screw. Because the metal radiating fins
2
′ and
3
′ are flat members, it is difficult to hold the crystal
1
′ in position during the soldering procedure. When fastening to the substrate, the metal radiating fin
3
′ tends to be deformed and forced away from the crystal
1
′. Further, because there is a big gap between the metal radiating fins
2
′ and
3
′, finished diodes will be in a tangle when put together. In order to prevent a tangle, finished diodes must be packed with an adhesive tape individually.
SUMMARY OF THE INVENTION
The present invention has been accomplished to provide a diode cooling arrangement, which eliminates the aforesaid drawbacks. It is one object of the present invention to provide a diode cooling arrangement, which does not deform easily during its mounting procedure. It is another object of the present invention to provide a diode cooling arrangement, which has means to hold the crystal in position during the soldering procedure. It is another object of the present invention to provide a diode cooling arrangement, which provides much heat dissipation area. It is still another object of the present invention to provide a diode cooling arrangement, which prevents a tangle when multiple finished diodes put together. According to the present invention, the metal radiating fin, which has a mounting hole for mounting, is provided with two upright flanges at two opposite lateral sides. The distance between the upright flanges is approximately equal to the diameter of the crystal so that the crystal can be positively secured in position during the soldering procedure. The upright flanges reinforce the structural strength of the respective metal radiating fin, and minimizes the gap between the metal radiating fins.
REFERENCES:
patent: 3766977 (1973-10-01), Pravda et al.
patent: 4057825 (1977-11-01), Narita et al.
patent: 5710745 (1998-01-01), Getreuer
patent: 5940273 (1999-08-01), Fishman et al.
patent: 6107711 (2000-08-01), Borchert
patent: 6254423 (2001-07-01), Lin
Chervinsky Boris L.
Dougherty & Troxell
Picard Leo P.
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