Dimensionally stable polyimide film and process for preparation

Stock material or miscellaneous articles – Structurally defined web or sheet – Physical dimension specified

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4284735, 428901, 528353, B32B 2728, B32B 2734, C08G 6926

Patent

active

047254840

ABSTRACT:
A dimensionally stable polyimide film and processes for the preparation thereof. The polyimide film is composed of an aromatic polyimide obtained from a solution of a polymer formed by polymerization of a biphenyl-tetracarboxylic acid and a phenylene diamine, wherein the average linear expansion coefficient of the polyimide film in the temperature range of from 50.degree. C. to 300.degree. C. is 0.1.times.10.sup.-5 to 2.5.times.10.sup.-5 cm/cm..degree.C., the ratio of the linear expansion coefficient in the machine direction of the film to the linear expansion coefficient in the transverse direction of the film is in the range of from 1/5 to 4, and the thermal dimension stability expressed by the ratio of the change of the size of the film at normal temperature after the heat treatment where the temperature is elevated to 400.degree. C. from normal temperature and the film is maintained at 400.degree. C. for 2 hours is less than 0.3%.

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