Dimensionally stable laminated printed circuit cores or boards a

Details Dimensionally stable laminated printed circuit cores or boards a Dimensionally stable laminated printed circuit cores or boards a

1978-06-23

1980-05-06

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29830, 156330, 156182, 1563077, 174 685, 428212, 428416, 428415, 428901, C09J 500

Patent

active

042016169

ABSTRACT:
A multi-layered printed circuit board is disclosed having a plurality of circuitized laminations therein. The laminates are fabricated or secured by curing layers of glass cloth which have been impregnated with heat curable resins at temperatures in excess of their glass transition temperature, the point at which such material begins to distort.
Those laminations which will see at least one further curing cycle, after having themselves been cured, are formed from glass cloth impregnated heat curable resin combinations having a glass transition temperature which is significantly higher than that of the heat curable materials employed to form the subsequently and singly cured laminations. In this manner, lamination shift or distortion is appreciably reduced since those laminations which undergo a plurality of "curing" cycles, only experience one excursion beyond their transition temperature. Thus, registration mismatch between any of the circuitized laminates will not exceed acceptable levels.

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patent: 3554877 (1971-01-01), Geisler
patent: 3654097 (1972-04-01), Degnan
patent: 3791858 (1974-02-01), McPherson et al.
patent: 3867759 (1975-02-01), Siefker
patent: 3969177 (1976-07-01), Doran et al.
patent: 4030190 (1977-06-01), Varker

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