Dimensionally graded conductive foam

Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Composite having voids in a component

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4283044, 4283184, B32B 514, B32B 326, B32B 900

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active

054319986

ABSTRACT:
A dimensionally graded electroconductive and electromagnetically responsive composite material is produced by contacting a polyurethane open cell foam substrate with a solution of an oxidatively polymerizable compound, such as pyrrole, that is polymerized to form a thin electroconductive polymer coating on the foam's surfaces. The reaction, wherein the compound is oxidized and polymerized to form a conductive polymer occurs over time. By varying the amount of time the porous foam substrate is in contact with the reacting solution a graded amount of electroconductive polymer is deposited on the foam substrate. The electrical activity of the resultant electrically conducting polyurethane/polypyrrole composite foam is measured as a Free Field Transmission loss at the microwave frequency of 10 GHz and expressed in "-dB". The polyurethane/polypyrrole composite foam with dimensionally graded electrical conductivity/activity constitutes a new bulk absorber.

REFERENCES:
patent: 3574295 (1971-04-01), Hajek
patent: 4287243 (1981-09-01), Neilsen
patent: 4468291 (1984-08-01), Naarmann et al.
patent: 4547270 (1985-10-01), Naarmann
patent: 4557807 (1985-12-01), Preston et al.
patent: 4604427 (1986-08-01), Roberts et al.
patent: 4617228 (1986-10-01), Newman et al.
patent: 4617353 (1986-10-01), Myers
patent: 4636430 (1987-01-01), Moehwald
patent: 4696835 (1987-09-01), Mau et al.
patent: 4707527 (1987-11-01), Druy et al.
patent: 4710401 (1987-12-01), Warren, Jr. et al.
patent: 4764422 (1988-08-01), Hill et al.
patent: 4798686 (1989-01-01), Hocker et al.
patent: 4803096 (1989-02-01), Kuhn et al.
patent: 4877646 (1989-10-01), Kuhn et al.
patent: 5063125 (1991-11-01), Yuh et al.
patent: 5063384 (1991-11-01), Novak et al.
patent: 5066424 (1991-11-01), Dixon et al.
patent: 5132490 (1992-07-01), Aldissi
patent: 5162135 (1992-11-01), Gregory et al.
Advances in the Chemistry of Conducting Organic Polymers: a Review, J. Reynolds, Journal of Molecular Electronics, vol. 2, 1-21.
Electrochemical Preparation and Characterization of Conducting Polymers, A. Daz, Chemica Scripta 17.
New Aspects on Intrinsically Conducting Organic Systems and their Synthesis, H. Naarmann, Macromol. Chem. Macromol. Symp. 1987 8,1.
A Chemical Route to Pyrrole Polymer Films, M. Salmon, K. K. Kanazawa A. F. Diaz; M. Krounbi; Journal of Polymer Science: Polymer Letters Edition, 1982, 20, 187.
An Electrically Conductive Plastic Composite Derived from Polypyrrole and Poly(vinyl Chloride), M. A. De Paoli; R. J. Waltman, A. F. Diaz; Bargon, Journal of Polymer Science, Polymer Chemistry Edition, 1985, 23, 1698.
Polymer-polypyrrole alloy films as semitransparent organic conductors, O. Niwa, M. Hikita, T. Tamamura; Applied Physics Letters, 1985 46, 4.
Electrochemical Preparation of Electrically Conducting Polyurethane/Polyaniline Composite, Q. Pei, X. Bi; Journal of Applied Polymer Science, 1989, 38, 1819.
An Electrically Conductive Composite Prepared by Electrochemical Polymerization of Pyrrole into Polyurethane, Z Bi, Q. Pei, Synthetic Metals; 1987, 22, 145.
Optimum Reaction Conditions for the Polymerization of Pyrrole by Iron (III) Chloride in Aqueous Solution, S. P. Armes; Synthetic Metals, 1987, 20, 365.

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