Dimension monitoring technique for semiconductor fabrication

Optics: measuring and testing – By polarized light examination – With light attenuation

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G01B 1100

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046391428

ABSTRACT:
A method of visually monitoring the change in dimensions of elements on a surface of a semiconductor body during processing is provided. A fixed pattern of scale images on the surface with a predetermined distance between images, together with a wedge-shaped element is provided on the surface. The wedge element has an apex adjacent one of the images and extends in a direction along other ones of the images. The semiconductor body is processed and the dimensions of the wedge-shaped element (as well as the scale image) change. One may then subsequently visually inspect the wedge shaped element with respect to the pattern of images to determine the extent of the change in dimension of the wedge shaped element during processing.

REFERENCES:
Murray, Kevin, "Measuring Dimensions Using Murray Daggers" Semiconductor International, Dec. 1982.

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